“Software package” laid out in ECCN 3D901 is managed for NS and RS factors to all Places as specified pursuant for the national security controls and license critique policy established forth in § 742. b. Semiconductor wafer fabrication tools made for ion implantation and owning any of the following: 3. https://building-inspection-sydne27925.kylieblog.com/30152951/the-ultimate-guide-to-thermal-imaging-inspection